TMS320C6654CZHA7的数据手册没有锡球采用焊料的材料说明,请问一下是什么?是否考虑锡须生长问题?
The datasheet for TMS320C6654CZHA7 does not mention the solder material used for the solder balls. Could you clarify what type of solder is used? Has the issue of tin whisker growth been considered?
感谢您对TI产品的关注!
已经收到了您的案例,TMS320C6654CZHA7的锡球是Sn-3.0Ag-0.5 Cu.
你可以查阅成分表中的 solder ball
www.ti.com/.../report
SAC305不需要考虑锡须生长, 纯锡的引脚处理,我们会做Whisker data JESD201A qual试验。