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IWR6843: 天线的表面镀层处理对天线性能的定量影响。

Part Number: IWR6843


你好。

spracg5中对PCB微带天线表面镀层的loss影响有这么一段描述,请问此处是否有更加精确的定量研究结果?ENIG处理的loss比镀银处理的loss多多少个dB呢?

谢谢。

Plating affects RF characteristics. Most common plating used in industry, Electroless Nickel-Immersion
Gold (ENIG), is not a good choice for mmWave boards due to its high losses. TI EVM uses immersion
silver plating that has lesser loss, comparatively. However, immersion silver is susceptible to oxidation on
prolonged exposure to air. This oxidation does not impact the RF performance. However, proper storage
of the PCB is recommended to reduce the oxidation. Over and under plating of top-layer copper can result
in phase and loss/reflection variations.