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LDC507X-SENSOR-DESIGN-TOOL: Inquiry About Coil Design for LDC5072

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Prodigy 70 points
Part Number: LDC507X-SENSOR-DESIGN-TOOL

I am currently working on a design utilizing the LDC5072 inductive sensing solution and have a question regarding the recommended coil placement in the PCB stackup. In the GERBER file designed by the design tool, the coil is typically designed on the top and bottom layers of the PCB.

My question is:
Could the coil be placed on the top layer and an inner layer (e.g., Layer 2), while using Layer 3 as a solid ground plane and placing the LDC5072 and other components on Layer 4?

If there are additional guidelines or simulation data available for non-standard coil placements, I would greatly appreciate your insights.

  • 0
    TI__Mastermind 29315 points

    您好，

    已经收到了您的案例，调查需要些时间，感谢您的耐心等待

  • +1 回复 Lydia
    TI__Mastermind 34605 points

    Hi,

    We have not looked at the stack-up you have described and don't have any information to share.
    The tool does not support the stack-up you have described.

    Theoretically, the PCB structure you have described should work, but there could indeed be some risks that we can't anticipate.
    The length of the vias that connect the coil traces across the layers will be different in your proposed stack-up compared to the stack-up used by the tool, and this may affect the coil's behavior.
    Flipping the components from the top layer top the bottom layer may change the trace routing unless you can shift the positions of the coil & device traces.
    Be sure no ground plane appears under the coils.