你好:
我们测得 HDC3021DEHR RH数值偏高,不稳定,2025/5/20烘烤前,2025/5/21~2025/5/26烘烤后测试观察下来的数值,稳定性不优。
你能给我们些建议吗。
想请问下:
1.组装加工后存放条件?是否受天气温度起伏变化影响?
2.测试环境条件?
3.如何标定产出芯片数值在规格范围内?标准品和样品的对照之类.
4.组装加工后运送过程常温即可还是有其他建议,让产品稳定性能优质
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