CC2640R2FRSMR
The parts epoxy fillet formation around the silicon die is acceptable base on the size of the silicon die versus the Die paddle. Manufacturer use the cross or double pattern to prevent the epoxy to overflow on the die paddle. Due to the parttern of the epoxy on the die paddle, when the Silicon die is put on the die paddle it will result to this spreadability and coverage for epoxy on the silicon die,
Engineer rejects the part. so do you have any documents to show us it wont be a problem and we can use it as usual.
