www.ti.com.cn/.../BT-MSPAUDSINK-RD
TI提供的“蓝牙 和 MSP430 音频信宿参考设计”开发板上焊接的是CC2564B吗?
我在原理图上看到的是CC2560,产品图片上是CC2564B。这个开发板应该焊接的是CC2564B吧?急盼回复!
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www.ti.com.cn/.../BT-MSPAUDSINK-RD
我在原理图上看到的是CC2560,产品图片上是CC2564B。这个开发板应该焊接的是CC2564B吧?急盼回复!