simplelink_lowpower_f3_sdk_7_20_00_29的SDK编译OAD工程,有3个bin文件,basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang_noheader.bin、
basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang_v1.bin、basic_ble_oad_onchip_LP_EM_CC2340R5_freertos_ticlang_v2.bin这3个固件有什么区别和作用

