TI工程师:
你好,请问一下芯片CC1120(贴片,VQFN 32 封装)中间是否要接地,如果不接地的话是否会导致芯片发烫?
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TI工程师:
你好,请问一下芯片CC1120(贴片,VQFN 32 封装)中间是否要接地,如果不接地的话是否会导致芯片发烫?