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LAUNCHXL-CC1310: 包含TIRTOS依赖的工程加入on-chip OAD配置后编译失败,显示TIRTOS链接错误

Part Number: LAUNCHXL-CC1310
Other Parts Discussed in Thread: CC1310

TI Teams:

    我使用CCS 12.0从simplelink_cc13x0_sdk_4_20_01_03导入了例程rfPacketErrorRate_CC1310_LAUNCHXL_tirtos_ccs,不作修改,直接编译成功。

我参考了例程rfWsnNodeIntFlashOadClient_CC1310_LAUNCHXL_tirtos_ccs的OAD设计,尝试把on-chip OAD配置移植到rfPacketErrorRate_CC1310_LAUNCHXL_tirtos_ccs中,做了以下修改:

1.删除原有的CC1310_LAUNCHXL_TIRTOS.cmd,从rfWsnNodeIntFlashOadClient拷贝CC1310_LAUNCHXL_TIRTOS_OAD.cmd到rfPacketErrorRate工程中

2.在rfPacketErrorRate工程的Arm Compiler-Predefined Symbols添加OAD_BLOCK_SIZE=64、FEATURE_OAD_ONCHIP、HAL_IMAGE_A

3.在rfPacketErrorRate工程的Arm Linker-Advanced Options-Command File Preprocessing添加FEATURE_OAD_ONCHIP、HAL_IMAGE_A

点击编译,显示TIRTOS链接错误如下

<Linking>
"F:/CC1310/tirtos_builds_CC1310_LAUNCHXL_release_ccs/Debug/configPkg/linker.cmd", line 704: warning #10096-D: specified address lies outside memory map
error #10264: DEFAULT memory range overlaps existing memory range FLASH
error #10264: DEFAULT memory range overlaps existing memory range SRAM
"../CC1310_LAUNCHXL_TIRTOS_OAD.cmd", line 96: error #10099-D: program will not fit into available memory, or the section contains a call site that requires a trampoline that can't be generated for this section. placement with alignment fails for section ".const" size 0x54b7. Available memory ranges:
FLASH size: 0xeff0 unused: 0x2a6c max hole: 0x2a6c
error #10010: errors encountered during linking; "rfPacketErrorRate_CC1310_LAUNCHXL_tirtos_ccs.out" not built

>> Compilation failure
makefile:163: recipe for target 'rfPacketErrorRate_CC1310_LAUNCHXL_tirtos_ccs.out' failed
gmake[1]: *** [rfPacketErrorRate_CC1310_LAUNCHXL_tirtos_ccs.out] Error 1
gmake[1]: Target 'secondary-outputs' not remade because of errors.
makefile:156: recipe for target 'all' failed
gmake: *** [all] Error 2

**** Build Finished ****

我注意到rfPacketErrorRate使用了Project Dependencies依赖TIRTOS。

rfWsnNodeIntFlashOadClient没有使用Project Dependencies依赖TIRTOS,但是也能创建Task。

请问:

1.我要如何修改rfPacketErrorRate,支持on-chip OAD,并编译成功?

2.我参考了BLE Enhanced OAD Advanced如何在BLE工程中加入on-chip OAD特性的文档,请问是否有sub 1G工程中加入on-chip OAD特性的文档?