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THS1408底部的散热焊盘需要接到地层吗？
目前用的带散热焊盘的封装，但是木有连接到地层，芯片可以工作。
THS1408的手册没有说Thermal PAD一定要接GND，但是比较推荐的做法是连接至地层，主要原因是散热，Thermal PAD需要连接至大块的铜层来加快散热，通常地层是比较常用的散热层。
看一下Power PAD相关的指导文件 slma004b
http://www.ti.com/lit/an/slma004b/slma004b.pdf
