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TI 是否提供这些开发套件的电路板设计文件? 获得这些数据将有助于创建焊锡膏掩模。
Joe
请参见随附的光绘文件。 扩展名为.gTP 的文件是顶部粘贴掩码、而.GBP 是底部。
此致
Dennis