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https://e2e.ti.com/support/microcontrollers/arm-based-microcontrollers-group/arm-based-microcontrollers/f/arm-based-microcontrollers-forum/1467155/am2431-fccsp-package
工具与软件：
基于德州仪器(TI) FCCSP 的封装是否在硅片和焊接凸点之间具有插入器、或者焊接凸点是否直接沉积在芯片本身上？ 如果使用插入器、它是由金属制成的、还是有机基板？
谢谢
阿里夫·汗
尊敬的 Arif：
AM2431使用有机基板/插入器。
此致、
Mike
