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https://e2e.ti.com/support/microcontrollers/c2000-microcontrollers-group/c2000/f/c2000-microcontrollers-forum/625067/tms320f28335-underfill-for-bga-package
你(们)好
我使用 F28335的客户想知道 BGA 封装是否需要进行额外的灌装。
您对此有何建议？
您是否见过很多客户使用此流程、或者是否需要此流程？
感谢你的帮助。
