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[参考译文] NE555:封装焊盘中心尺寸与数据表 LAN 模式不匹配

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Other Parts Discussed in Thread: NE555, NA555

请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。

https://e2e.ti.com/support/clock-timing-group/clock-and-timing/f/clock-timing-forum/1631720/ne555-footprint-pad-center-dimention-not-matching-with-datasheet-lan-pattern

部件号: NE555
主题中讨论的其他部件: NA555

你(们)好  

 

器件型号 NE555DR SOIC 8 D — 封装焊盘中心尺寸与数据表 LAN 图案不匹配  

封装焊盘中心尺寸:4.9mm、  

数据表 LAN 图案焊盘中心尺寸:5.4mm