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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/739391/sn74lvc08a-don-t-solder-the-exposed-thermal-pad
在我的电路中、这个 QFN 封装的 IC 在很大程度上是静态的、所以我不需要裸片连接焊盘来解决散热问题。 我是否仍需要将其焊接到 PCB 上的散热焊盘？ 如果是、应该将其接地还是保持悬空？ 谢谢。
