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https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/566666/msp430fr5738-bga-ball-solder-material
您好！
我正在寻找 有关 MSP430FR5738IYQD 上 BGA 焊球的焊料组成的信息。 数据表中是否列出 了 SnAgCu 有关成分的更多详细信息？
感谢您的帮助、
Jake
具体的焊料构成是什么？
我需要知道 SAC 的编号(即 SAC 105、305、405等)
Clyde
