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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1531118/lm21212-2-junction-to-case-top-of-package-and-junction-to-board-thermal-resistance
工具/软件：
我正在寻找结至外壳（封装顶部）和结至电路板热阻。 我在数据表上只能看到 θ JA（结至空气）。
您好、
这是一款相当旧的大型器件、没有提供完整的热参数。 TPS62872 或 TPS6287B15 是否无法满足您的需求？
谢谢、
Chris
