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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1032782/tlc6983-footprint
您好、先生、
我从 Ultra Librarian 下载适用于 TI的 VQFN76封装。
但散热焊盘上没有通孔。
请帮助更新 PADS v2009的版本。
谢谢你。
大家好、
感谢您的提醒、我们将更新封装。
BR
徐美奈
