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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/885790/tps65912-solder-ball-snagcu-composition
您能否以 SnAgCu 在 本器件中的百分比形式告知焊球成分？ 封装为 DSBGA YFF 81引脚。
大家好、David、
请告知您的客户、我们将 SAC396用于该器件。 SAC396包含95.5%锡(Sn)、3.9%银(Ag)和0.6%铜(Cu)。
