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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/632470/tps63050-is-tps63050yffr-which-is-wlcsp-packaging-using-rdl-tech-during-packaging
尊敬的先生/女士：
我想检查以下哪两款 TI IC 的 ELCSP 封装在封装过程中是否使用 RDL 技术？
LM3671
TPS63050
有关 RDL 的更多详细信息、请访问：
此致、 公里/小时
