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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/754389/tlc6c5912-ground-pad-for-footprint
TLC6C5912数据表的第11节显示了一个布局示例、该示例在器件下方具有较大的 GND 填充区域、但引脚20是唯一的 GND 引脚。 通常、芯片下方有一个较大的覆铜区、这意味着封装底部有一个 GND 焊盘、但第21-22页的封装图没有显示底焊盘。
结至电路板热阻是否仅通过引脚20？
谢谢、
Lee
