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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/657467/lm5001-lm5001---thermal-junction-to-board-specs
我正在寻找 LM5001 SOIC 封装的热结至电路板详细信息。
数据表中仅列出结至环境参数和结至外壳参数。
