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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/619744/lm5005-lm5005
在反相操作(即产生负输出电压)中使用 LM5005时、应将器件背面的外露焊盘连接到什么？ 它应该仍然连接到 AGND 和 PGND (现在不是"接地")、还是应该仍然连接到带有通孔的接地端、以实现尽可能大的散热能力？
感谢您的快速响应
