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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/666127/lm317-thermal-resistance-datasheet-confusion
在 LM317数据表中、结至外壳(顶部)热阻的热阻为~16C/W 这似乎有点高、这意味着金属凸片或这意味着什么、因为结至电路板热阻(~5C/W)似乎稍微接近我的预期。 此外、将各种(散热器、结至凸片等)热阻加在一起以最终通过施加到最大额定温度来获得最大功率耗散的公式是什么？
