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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/741341/tps82085-issue-with-example-board-layout
您好、先生、
数据表第20页显示了 TPS82085的封装轮廓为2.7~2.9 x 2.9~3.1mm (2.8mmx3mm)、
但第21页示例电路板布局比 IC 尺寸小2.2+(0.5/2)*2=2.7mm， 这是正确的吗？
可能存在焊接风险不足？
Hugo
