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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/709345/lmz13610-need-thermal-resistance-data
数据表列出了结至顶部外壳的热阻为1°C/W 问题：
该封装底部有一个外露焊盘。 结至焊盘或结至电路板的热阻是多少？
Jimmy、
您是否听说过开发人员有关此问题的消息？
此致、
Tom
