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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/685745/lm5145-lm5145-thermal-pad-vias-finishing-open-conductive-filled-non-conductive-filled
大家好、LM5145下的散热焊盘建议使用额外的通孔来散热。
此外、在数据表 中、建议填充、插入或包覆焊锡膏下方的通孔。
由于这专门用于散热、最好使用导电填充剂来填充这些过孔吗？
此致
好的、谢谢
