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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/704224/bq500101-soldermask-design-for-dpc-package-bq500101
TI 封装库中没有 DPC 封装条目。
BQ500101的数据表仅声明了该 Pastemask、但未定义焊层。
该封装不受标准技术(扩展50µm、最小滑块100µm)的影响。
您能否为首选阻焊层提供建议？
谢谢！
