• 状态 Resolved
  • 已锁定 已锁定
  • 回复 1 回复
  • 订户 0 订户
  • 视图 149 视图
  • 用户 0 会员在此处
选项
选项
相关

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

[参考译文] CSD19537Q3：是在外壳顶部还是在底部测量结至外壳热阻？

admin
Guru**** 2652475 points
请注意，本文内容源自机器翻译，可能存在语法或其它翻译错误，仅供参考。如需获取准确内容，请参阅链接中的英语原文或自行翻译。

https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1284870/csd19537q3-is-the-junction-to-case-thermal-resistance-measured-at-the-top-of-the-case-or-at-the-bottom

器件型号：CSD19537Q3

是在外壳顶部或外壳底部(即散热焊盘)测量的 R_THETAJC in 5.2

提前感谢您、Kurt