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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1336442/lm117hvqml-sp-lead-material-for-cfp-nac-package
P/N LM117HVQML-SP 的 CFP 封装的铅材料是什么？
Josh、您好！
LM117HVQML-SP 采用 CFP 封装的铅材料为名为"合金42"的镍铁、镍含量为42%、铁含量为52%。
然后使用63/37锡铅焊料完成引线测试。
谢谢。
Andy Fondaw
