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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1352733/lp8556-wqfn-exposed-pad-connexion-----lp8556sq
您好！
LP8556SQ-E09/NOPB 芯片的 WDFN 封装上有一个外露散热焊盘。
它应该被连接至 GND 还是应该被保持未连接？
此致。
西尔万
尊敬的 Sylvain：
也请将散热焊盘连接到 GND。
Br
帕特里克
