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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1389302/tlc77-bond-wire-strength-testing-method-bond-pull-or-bond-shear
工具与软件：
您好！
使用器件并生成新键合线材料的测试程序。
评估铜键合线的键合强度首选哪种测试方法？
您好！ 使用了这两种测试方法。
