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[参考译文] AM62A7:如何将固件构建器 SDK 的更改与 Yocto SDK 结合使用。

Guru**** 2482225 points


请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1445088/am62a7-how-to-incorporate-changes-of-the-firmware-builder-sdk-with-yocto-sdk

器件型号:AM62A7

工具与软件:

您好!  

SKD:9.1.0

EVM:AM62A SK

我们使用的是 AM62A SK EVM、SDK 为9.1.0。 在摄像头传感器测试期间、我们找到了 LSC (镜头阴影校正)。 因此、我们必须使用固件生成器 SDK。 Firmware Builder SDK 使用 Processor SDK 生成要在 EVM 上使用的 tispl.bin。  

在构建过程中、尚不清楚哪些文件是从固件构建器 SDK 复制到处理器 SDK 的、以及如何生成 tispl.bin。

问题1:

有没有办法找出哪些文件是从固件生成器 SDK 复制到 Processor SDK 的?

问题2:

因为我们将 Yocto SDK 用于 EVM 版本以及我们的定制电路板、所以有没有在 Yocto SDK 中包含固件生成器 SDK 更改。

请做必要的相同。

此致、

Jay

  • 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。

    您好、Jay:

    既然我们正在使用 Yocto SDK 进行 EVM 构建以及定制电路板、是否有必要在 Yocto SDK 中加入固件生成器 SDK 更改。

    我不知道详细信息、但针对 tispl.bin 的 Yocto 方法应该依赖于固件构建器生成的二进制文件。 找出必要的二进制文件后、我希望您可以修改方法、通过 Yocto 构建 tispl.bin。

    此致、

    建中

  • 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。

    尊敬的建中:

    感谢您的答复。  

    根据固件构建器 SDK 和 Processor SDK 的日志、" vx_app_rtos_linux_mcu1_0_strip.out "将从固件构建器 SDK 复制到处理器 SDK、并将其作为文件" ipc_echo_testb_mcu1_0_release_strip.xer5f "

    TARGET_COMBO=AM62A:LINUX:A53:1:release:GCC_LINUX_ARM
    Required system library libdl.so
    Linking /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/onnxrt_ep/out/AM62A/A53/LINUX/release/libtidl_onnxrt_EP.so
    Required system library libdl.so
    Linking /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/tfl_delegate/out/AM62A/A53/LINUX/release/libtidl_tfl_delegate.so
    Copying built libraries: /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/onnxrt_ep/out/AM62A/A53/LINUX/release to /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/onnxrt_ep/lib/AM62A/A53/LINUX/release
    make[3]: Leaving directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/onnxrt_ep'
    Copying built libraries: /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/tfl_delegate/out/AM62A/A53/LINUX/release to /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/tfl_delegate/lib/AM62A/A53/LINUX/release
    make[3]: Leaving directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl/tfl_delegate'
    make[2]: Leaving directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/c7x-mma-tidl/arm-tidl'
    make[1]: Leaving directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/sdk_builder'
    make uboot
    make[1]: Entering directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/sdk_builder'
    cp /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/vision_apps/out/AM62A/R5F/FREERTOS/release/vx_app_rtos_linux_mcu1_0.out /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/vision_apps/out/AM62A/R5F/FREERTOS/release/vx_app_rtos_linux_mcu1_0_strip.out
    /home/admin/ti/ti-cgt-armllvm_3.2.0.LTS/bin/tiarmstrip -p /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/vision_apps/out/AM62A/R5F/FREERTOS/release/vx_app_rtos_linux_mcu1_0_strip.out
    cp /home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/vision_apps/out/AM62A/R5F/FREERTOS/release/vx_app_rtos_linux_mcu1_0_strip.out /home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/prebuilt-images/ti-dm/am62axx/ipc_echo_testb_mcu1_0_release_strip.xer5f
    make -C /home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-* ARCH=arm CROSS_COMPILE=/home/admin/ti/arm-gnu-toolchain-11.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- O=am62a-arm64-linux -j8 am62ax_evm_a53_defconfig
    make[2]: Entering directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/sdk_builder'
    make[2]: warning: -j8 forced in submake: resetting jobserver mode.
    make[3]: Entering directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732/am62a-arm64-linux'
      GEN     Makefile
    arch/../configs/am62ax_evm_a53_defconfig:164:warning: override: reassigning to symbol SUPPORT_EMMC_BOOT
    #
    # configuration written to .config
    #
    make[3]: Leaving directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732/am62a-arm64-linux'
    make[2]: Leaving directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732'
    make -C /home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-* ARCH=arm CROSS_COMPILE=/home/admin/ti/arm-gnu-toolchain-11.3.rel1-x86_64-aarch64-none-linux-gnu/bin/aarch64-none-linux-gnu- BL31=/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/prebuilt-images/bl31.bin TEE=/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/prebuilt-images/bl32.bin BINMAN_INDIRS=/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/prebuilt-images O=am62a-arm64-linux
    make[2]: Entering directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732'
    make[3]: Entering directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732/am62a-arm64-linux'
      GEN     Makefile
    scripts/kconfig/conf  --syncconfig Kconfig
      CFG     u-boot.cfg
      GEN     include/autoconf.mk.dep
      CFG     spl/u-boot.cfg
      GEN     include/autoconf.mk
      GEN     spl/include/autoconf.mk
      GEN     Makefile
      ENVC    include/generated/env.txt
      UPD     include/generated/timestamp_autogenerated.h
      ENVP    include/generated/env.in
      ENVT    include/generated/environment.h
      Using .. as source for U-Boot
      CC      cmd/version.o
      AR      cmd/built-in.o
      CC      env/common.o
      CC      lib/efi_loader/dtbdump.o
      CC      lib/efi_loader/initrddump.o
      AR      env/built-in.o
      LD      lib/efi_loader/initrddump_efi.so
      OBJCOPY lib/efi_loader/initrddump.efi
      LD      lib/efi_loader/dtbdump_efi.so
      OBJCOPY lib/efi_loader/dtbdump.efi
      LD      u-boot
      OBJCOPY u-boot.srec
      OBJCOPY u-boot-nodtb.bin
      SYM     u-boot.sym
      RELOC   u-boot-nodtb.bin
      CAT     u-boot-fit-dtb.bin
      MKIMAGE u-boot.img
      MKIMAGE u-boot-dtb.img
      COPY    u-boot.bin
      FDTGREP spl/dts/k3-am62a7-sk.dtb
      MKIMAGE spl/u-boot-spl.multidtb.fit
      CC      spl/common/spl/spl.o
      CC      spl/env/common.o
      AR      spl/env/built-in.o
      AR      spl/common/spl/built-in.o
      LD      spl/u-boot-spl
      SYM     spl/u-boot-spl.sym
      OBJCOPY spl/u-boot-spl-nodtb.bin
      CAT     spl/u-boot-spl-dtb.bin
      COPY    spl/u-boot-spl.bin
      BINMAN  .binman_stamp
    Image 'fsstub-hs' is missing external blobs but is still functional: fsstub-hs-cert.bin fsstub-hs-enc.bin
    Image 'fsstub-fs' is missing external blobs but is still functional: fsstub-fs-cert.bin fsstub-fs-enc.bin
    Image 'fsstub-gp' is missing external blobs but is still functional: fsstub-gp.bin
      OFCHK   .config
    make[3]: Leaving directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732/am62a-arm64-linux'
    make[2]: Leaving directory '/home/admin/jay/firmware_builder/ti-processor-sdk-linux-edgeai-am62axx-evm-09_01_00_07/board-support/ti-u-boot-2023.04+gitAUTOINC+b0d717b732-gb0d717b732'
    make[1]: Leaving directory '/home/admin/jay/firmware_builder/ti-firmware-builder-am62axx-evm-09_01_00_07/sdk_builder'

    似乎  ipc_echo_testb_mcu1_0_release_strip.xer5f  文件不用于的编译 tispl.bin。 所以、后台还有一些其他事件负责生成 tispl.bin。  

    固件构建器 SDK 团队的任何人都可以帮助我们了解如何使用固件构建器 SDK 在 Processor SDK 中生成 tispl.bin。 我已经花了2天,但没有得到任何线索在这.

    此致、

    Jay

  • 请注意,本文内容源自机器翻译,可能存在语法或其它翻译错误,仅供参考。如需获取准确内容,请参阅链接中的英语原文或自行翻译。

    您好、Jay:

    我向固件构建团队核实了这一点。 事实上、固件并非使用 Yocto 构建。 当使用 Yocto 构建 SDK 时、固件二进制文件直接从 git.ti.com: https://git.ti.com/cgit/processor-sdk/psdk_fw/tree/am62a/vision_apps_eaik?h=main中提取。 请参考此配方: https://git.ti.com/cgit/edgeai/meta-edgeai/tree/recipes-tisdk/ti-psdk-rtos/ti-edgeai-firmware.bb?h=scarthgap#n27。

    首先、您需要构建固件、然后使用固件二进制文件构建 SDK。

    此致、

    建中