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I downloaded TIDM-1101's Gerber file from TIDM-1011 reference design | TI.com, but I find this file missing the Groud Plane Layer when when I went into production. TIDM-1011 is a four-layer PCB board, the absence of Groud Plane Layer leads to the failure of normal production
Hi,
I post this issue to the relevant engineer, and will reply you once I get response. Thanks for you patience.
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Thanks & Regards
Yale
Hi,
The BOOSTXL-POSMGR is the same hardware design, but updated. https://www.ti.com/tool/BOOSTXL-POSMGR
You can download the design files here: https://www.ti.com/lit/zip/sprr422
It should have everything but please verify the gerbers yourself to be certain.
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Thanks & Regards
Yale