LM385-1.2: X-RAY found a large number of gaps in the bonding between the internal wafer and the frame

Part Number: LM385-1.2


The part number I purchased:LM385Z-1.2/NOPB ,After X-RAY inspection, it was found that there were many voids at the epoxy resin silver adhesive joint between the internal wafer and the frame base, Please take a look at the picture!These voids exceed the military standard MIL-STD-883 and are considered qualified if they are less than or equal to 50%It is obvious that the holes in the picture exceed 50% ,Because this part is of commercial grade, can military grade standards be used to determine whether it is qualified or unqualified? I want to know if it is qualified or unqualified, Does your company conduct X-ray testing before leaving the factory?
Looking forward to your reply, thank you!
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  • 您好,收到了您的案例,调查需要些时间,感您的耐心等待。

  • Hi,

    Thank you for contacting TI E2E Chinese Forum.

    TI forums are designed to address technical issues that customers encounter when using TI products. For X-ray problems, it is recommended that you contact Customer Support as follows and a customer service will be available to assist you.
    •Open the link ticsc.service-now.com/csm
    •Click on the “Submit a request” button under “Request new support”
    •Click on Quality in the newly opened window Reliability and environmental information
    •In the form that opens, you can describe your problem in Chinese and submit it.