現在用二顆LM317設計電池定電壓、定電流的充電電路,
輸入電壓為24V經過LM317降為13.5V、0.25A對電池充電,在充電過程中,LM317會發熱到75度C左右,請問若我用R-PDSO-G4這個包裝LAYOUT時,IC散熱的地方在PCB板上用小面積鋪錫的方法散熱,不知是否可行?
謝謝!
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this device is compliance with Jedec 020D
每颗LM317损耗(24-13.5)×0.25/2=1.31W,SOT223的QJC=30.6C/W, 芯片内部与外表面的温差为40度,如果目前测得稳定时的温度是75度,芯片内部温度为115度, 允许最高温度为150度,方案可行。