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采用温度传感器芯片,型号: TMP117MAIDRVR,封装: WSON-6 , 设计电路时,Exposed Thermal Pad 应该怎么设计?应该悬空还是接地 ?
您好,
采用不同材质的PCB,Thermal Pad的连接建议是不一样的;对是否进行系统校准,也是不同的建议;请根据您的设计情况参考datasheet的Layout指导设计: