采用温度传感器芯片,型号: TMP117MAIDRVR,封装: WSON-6 , 设计电路时,Exposed Thermal Pad 应该怎么设计?应该悬空还是接地 ?
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采用温度传感器芯片,型号: TMP117MAIDRVR,封装: WSON-6 , 设计电路时,Exposed Thermal Pad 应该怎么设计?应该悬空还是接地 ?