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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/638899/tps65218-layout-what-is-the-correct-number-of-recommended-ground-pad-vias
TPS65218数据表规定、散热焊盘应使用最少25个过孔连接到 PCB 接地层。 我还看到 TPS65128 EVM 具有25个过孔配置、用于散热焊盘配置。
但是、ARM MPU AM438X ePOS EVM 的光绘文件仅显示9个通孔。
问题是、哪一项是正确的？ 我假设有25个通路、如果是、为什么 AM438X EVM 布局有9个通路？
