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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1471887/lm5069-requisition-for-junction-to-case-bottom-thermal-resistance-and-case-temp-c-max-of-lm5069mm-2-nopb
工具与软件：
尊敬的 TI 团队： 您好！ 我们想知道 结至外壳(底部)热阻和 LM5069MM-2/NOPB 允许的最大结温
感谢您的咨询。 抱歉、我们没有这些数据。
