這顆料平面度到0.15mm，TI 規格書建議開0.15mm鋼板；高於目前加工廠常用的0.1mm, 0.12mm厚度，有一定的風險空焊, 會造成後端生產上的問題。
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The amount of the paste is dependent on the stencil thickness.
The .127 thickness would be a possibility if customer can make some changes to ensure that the solder paste to solder the ball is available.
I will check internally and update you on the feasibility.